|
|
|
|
|
|
While generally focused on contacts, our engineering talent can be brought to bear on any mechanical, electrical and thermal analysis involving small system components. Experience with hyper-elastic media is at hand to assist in areas outside the "normal" design envelope. Multi-physics analysis can be brought into the fold if the problem complexity necessitates this effort. Experience with several analysis packages is available. Choice of a particular solution depends on requirements of the problem and is generally made to yield the most expedient and cost efficient approach. |
|
|
Printable Page